WE BRING IT ALL TOGETHER

MEMS, Sensors, Fusion
Packaging, 3D Electronics, Systems Integration
Software/API's

We bring to market world-class teams of MEMS and Sensor experts who are industry leaders in the global technology markets. 

Our Core:

Design

Modeling

Process Development 

Optimization

Prototyping

Qualification

Technology transfer

Key innovations are realized when MEMS & Sensors are combined into systems that enable emerging smart system, improvements in operational efficiency, quality, and safety.

Our Core:

CMOS + MEMS

Packaging

System level packaging

System in Package (SIP)

Wafer level packaging

3D packaging

We develop software & API's enabling systems to function, gather data, and become smarter as time goes by.

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