WE BRING IT ALL TOGETHER
MEMS, Sensors, Fusion
Packaging, 3D Electronics, Systems Integration
We bring to market world-class teams of MEMS and Sensor experts who are industry leaders in the global technology markets.
Key innovations are realized when MEMS & Sensors are combined into systems that enable emerging smart system, improvements in operational efficiency, quality, and safety.
CMOS + MEMS
System level packaging
System in Package (SIP)
Wafer level packaging
We develop software & API's enabling systems to function, gather data, and become smarter as time goes by.